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 SEMICONDUCTOR
TECHNICAL DATA
General Description
KHB011N40P1/F1/F2
N CHANNEL MOS FIELD EFFECT TRANSISTOR
KHB011N40P1
A O C F E G B Q I
DIM MILLIMETERS _ 9.9 + 0.2 A B C D E
This planar stripe MOSFET has better characteristics, such as fast switching time, low on resistance, low gate charge and excellent avalanche characteristics. It is mainly suitable for electronic ballast and switching mode power supplies. FEATURES
VDSS(Min.)= 400V, ID= 10.5A Drain-Source ON Resistance : RDS(ON)=0.53 @VGS =10V Qg(typ.) =32.5nC
K M L J D N N
P
F G H I J
15.95 MAX 1.3+0.1/-0.05 _ 0.8 + 0.1 _ 3.6 + 0.2 _ 2.8 + 0.1 3.7 0.5+0.1/-0.05 1.5 _ 13.08 + 0.3 1.46 _ 1.4 + 0.1 _ 1.27 + 0.1 _ 2.54 + 0.2 _ 4.5 + 0.2 _ 2.4 + 0.2 _ 9.2 + 0.2
H
K L M N O P Q
1
2
3
MAXIMUM RATING (Tc=25
RATING CHARACTERISTIC SYMBOL KHB011N40F1 UNIT KHB011N40P1 KHB011N40F2 400 30 10.5 ID 6.6 IDP EAS EAR dv/dt 135 PD 1.07 Tj Tstg 150 -55 150 0.35 W/ 42 360 13.5 4.5 44 6.6* 42* mJ mJ V/ns W
Q 1 2 3
1. GATE 2. DRAIN 3. SOURCE
TO-220AB
KHB011N40F1
Drain-Source Voltage Gate-Source Voltage @TC=25 Drain Current @TC=100 Pulsed (Note1) Single Pulsed Avalanche Energy (Note 2) Repetitive Avalanche Energy (Note 1) Peak Diode Recovery dv/dt (Note 3) Drain Power Dissipation Tc=25 Derate above25
VDSS VGSS
V V 10.5* A
K E
A F
C
O
DIM
B
MILLIMETERS
L
M J
R
D N N
H
A B C D E F G H J K L M N O Q R
_ 10.16 + 0.2 _ 15.87 + 0.2 _ 2.54 + 0.2 _ 0.8 + 0.1 _ 3.18 + 0.1 _ 3.3 + 0.1 _ 12.57 + 0.2 _ 0.5 + 0.1 13.0 MAX _ 3.23 + 0.1 1.47 MAX 1.47 MAX _ 2.54 + 0.2 _ 6.68 + 0.2 _ 4.7 + 0.2 _ 2.76 + 0.2
G
1. GATE 2. DRAIN 3. SOURCE
Maximum Junction Temperature Storage Temperature Range Thermal Characteristics Thermal Resistance, Junction-to-Case Thermal Resistance, Case-to-Sink Thermal Resistance, Junction-toAmbient
TO-220IS (1)
KHB011N40F2
RthJC RthCS RthJA
A
0.93 0.5 62.5
2.86 62.5
C F
/W
S
/W /W
P
E G B
DIM
MILLIMETERS
* : Drain current limited by maximum junction temperature.
K L L R J
PIN CONNECTION
D
M
D
N N
D
H
G
1
2
3
A B C D E F G H J K L M N P Q R S
_ 10.0 + 0.3 _ 15.0 + 0.3 _ 2.70 + 0.3 0.76+0.09/-0.05 _ 3.2 +0.2 _ 3.0 + 0.3 _ 0.3 12.0 + 0.5+0.1/-0.05 _ 13.6 + 0.5 _ 3.7 + 0.2 1.2+0.25/-0.1 1.5+0.25/-0.1 _ 2.54 +0.1 _ 6.8 + 0.1 _ 4.5 + 0.2 _ 2.6 + 0.2 0.5 Typ
Q
1. GATE 2. DRAIN 3. SOURCE
S
TO-220IS
2007. 5. 10
Revision No : 0
1/1
KHB011N40P1/F1/F2
ELECTRICAL CHARACTERISTICS (Tc=25
CHARACTERISTIC
)
TEST CONDITION MIN. TYP. MAX. UNIT
SYMBOL
Static
Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Drain Cut-off Current Gate Threshold Voltage Gate Leakage Current Drain-Source ON Resistance BVDSS BVDSS/ Tj IDSS Vth IGSS RDS(ON) ID=250 A, VGS=0V ID=250 A, Referenced to 25 VDS=400V, VGS=0V, VDS=VGS, ID=250 A VGS= 30V, VDS=0V VGS=10V, ID=5.25A 400 2.0 0.54 0.5 10 4.0 100 0.53 V V/ A V nA
Dynamic
Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-on Delay time Turn-on Rise time Turn-off Delay time Turn-off Fall time Input Capacitance Reverse Transfer Capacitance Output Capacitance Source-Drain Diode Ratings Continuous Source Current Pulsed Source Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge IS VGSNote 1) Repetivity rating : Pulse width limited by junction temperature. Note 2) L = 5.7mH, IS=10.5A, VDD=50V, RG = 25 , Starting Tj = 25 . Note 3) IS 10.5A, dI/dt 200A/ , VDD 300 BVDSS, Starting Tj = 25 . , Duty Cycle 2%. Note 4) Pulse Test : Pulse width
Note 5) Essentially independent of operating temperature.
2007. 5. 10
Revision No : 0
2/7
KHB011N40P1/F1/F2
Fig1. ID - VDS
VGS TOP : 15.0 V 10.0 V 1 8.0 V 10 7.0 V 6.0 V 5.5 V 5.0 V Bottom: 4.5V
Fig2. ID - VGS
Drain Current ID (A)
Drain Current ID (A)
10
1
10
0
10
0
150 C
25 C
-1
-55 C
10
-1
10
-1
10
0
10
1
10
2
4
6
8
10
Drain - Source Voltage VDS (V)
Gate - Source Voltage VGS (V)
Fig3. BVDSS - Tj
Normalized Breakdown Voltage BVDSS
1.2
Fig4. RDS(ON) - ID
2.0
On - Resistance RDS(ON) ()
VGS = 0V IDS = 250A
1.1
1.5
VGS = 10V
1.0
1.0
VGS = 20V
0.9
0.5
0.8 -100
0 -50 0 50 100 150 0 5 10 15 20 25 30 35
Junction Temperature Tj ( C )
Drain Current ID (A)
Fig5. IS - VSD
3.0
Fig6. RDS(ON) - Tj
VGS = 10V IDS =5.25A
Reverse Drain Current IS (A)
10
1
Normalized On Resistance
1.0 1.2 1.4 1.6
2.5 2.0 1.5 1.0 0.5
10
0
150 C 25 C
10
-1
0.2
0.4
0.6
0.8
0.0 -100
-50
0
50
100
150
Source - Drain Voltage VSD (V)
Junction Temperture Tj ( C )
2007. 5. 10
Revision No : 0
3/7
KHB011N40P1/F1/F2
Fig7. C - VDS
2800 2400 12
Fig8. Qg- VGS
Gate - Source Voltage VGS (V)
Frequency = 1MHz ID = 10.5A VDS = 80V VDS = 200V VDS = 320V
10 8 6 4 2 0 0 5 10
Capacitance (pF)
2000 1600
Ciss
Coss
1200 800 400 0 10-1 100 101
Crss
15
20
25
30
Drain - Source Voltage VDS (V)
Gate - Charge Qg (nC)
Fig9. Safe Operation Area
(KHB011N40P1) 102
Operation in this area is limited by RDS(ON)
10s
Fig10. Safe Operation Area
(KHB011N40F1, KHB011N40F2) 102
Operation in this area is limited by RDS(ON)
10s
Drain Current ID (A)
Drain Current ID (A)
10
1
100s
101
0
100s
1ms
1ms
10
10ms 100ms
100
Tc= 25 C Tj = 150 C -1 Single nonrepetitive pulse
10ms 100ms DC
10
-1
DC
10
100
101
102
103
10
Tc= 25 C Tj = 150 C -2 Single nonrepetitive pulse
100
101
102
103
Drain - Source Voltage VDS (V)
Drain - Source Voltage VDS (V)
Fig11. ID - Tj
12 10
Drain Current ID (A)
8 6 4 2 0 25 50 75 100 125 150
Junction Temperature Tj ( C)
2007. 5. 10
Revision No : 0
4/7
KHB011N40P1/F1/F2
Fig12. Transient Thermal Response Curve
Normalized Transient Thermal Resistance
100
Duty=0.5
0.2
10-1
0.1
0.05
PDM t1 t2
Single Pulse
0.02
0.01
- Duty Factor, D= t1/t2 10-3 10-2 10-1 100 101
10-2 10-5
10-4
TIME (sec)
Fig13. Transient Thermal Response Curve
Normalized Transient Thermal Resistance
100
Duty=0.5
0.2
10-1
0.1
0.05
PDM
0.02
0.01
t2
- Duty Factor, D= t1/t2
Single Pulse
10-2 10-5 10-4
10-3
10-2
10-1
100
101
TIME (sec)
2007. 5. 10
Revision No : 0
5/7
KHB011N40P1/F1/F2
Fig14. Gate Charge
VGS 10 V ID Fast Recovery Diode
0.8 VDSS 1.0 mA
ID Q VDS VGS Qgs Qgd Qg
Fig15. Single Pulsed Avalanche Energy
EAS= 1 LIAS2 2 BVDSS BVDSS - VDD
BVDSS
L
IAS
50V 25 VDS 10 V ID(t)
VGS
VDD
VDS(t)
Time tp
Fig16. Resistive Load Switching
VDS 90% RL
0.5 VDSS
25 VDS 10V VGS 10% tf td(on) ton tr td(off) toff
VGS
2007. 5. 10
Revision No : 0
6/7
KHB011N40P1/F1/F2
Fig17. Source - Drain Diode Reverse Recovery and dv /dt
DUT VDS IF
Body Diode Forword Current
ISD (DUT)
IRM
di/dt
IS
Body Diode Reverse Current
0.8 x VDSS
VDS (DUT) driver Body Diode Recovery dv/dt VSD VDD 10V
VGS
Body Diode Forword Voltage drop
2007. 5. 10
Revision No : 0
7/7


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